I was also curious - with this modification, is it possible to use sensorless homing for a secondary min endstop? This would reduce hardware requirements quite a bit for my setup.
Thinking further (and I know I’m possibly asking a lot) it would be cool if you can adjust the sensitivity of sensorless homing per additional endstop or even just the min endstop so it’s different than the max. The reason being is that when you place components for a pick and place machine to assemble circuit boards, you ideally want to put as little pressure as possible on tiny components (0402, 0603, etc) and more pressure on larger components (MCU chips). Putting too much pressure on tiny components like 0402 could cause them to fly out from under the nozzle and putting too little pressure on large components could cause them to not reflow well where there’s bad contact with the pins. Something to keep in mind if you want to expand further on this 